Product Update Notification May 23 2025
We’re excited to announce new package options for the nRF54L Series.
Following the successful introduction of the nRF54L15, nRF54L10, and nRF54L05, all three SoCs are now in volume production in a pin-to-pin compatible QFN package. We've also reached full-volume production for our fourth package option, the nRF54L15 WLCSP variant.
|
SoCs |
Package |
Size |
Pin/balls |
GPIOs |
Pin-to-pin compatible |
Availability |
|
nRF54L15, nRF54L10, nRF54L05 |
QFN48 |
6x6 mm |
48 |
31 |
Yes |
Full-volume production |
|
nRF54L15 |
WLCSP |
2.4x2.2 mm |
47 |
32 |
No |
Full-volume production |
Looking ahead, sampling has now begun for two additional QFN packages - QFN40 and QFN52 - for all three SoCs. Both new packages maintain pin-to-pin compatibility, offering more design options while simplifying hardware reuse.
|
SoCs |
Package |
Size |
Pin/balls |
GPIOs |
Pin-to-pin compatible |
Availability |
|
nRF54L15, nRF54L10, nRF54L05 |
QFN40 |
5x5 mm |
40 |
22 |
Yes |
Sampling |
|
nRF54L15, nRF54L10, nRF54L05 |
QFN52 |
6x6 mm |
52 |
35 |
Yes |
Sampling |
In parallel, the release of nRF Connect SDK v3.0.1 delivers full support for all production nRF54L Series SoCs, including
- Production-grade drivers and middleware
- Bluetooth® LE qualification to Core Specification 6.0
- Experimental support for the new sQSPI SoftPeripheral
For more in-depth information, we invite you to read the full blog post
>> nRF54L Series: Fourth package now in production, with more coming